Curable organopolysiloxane composition and a semiconductor...

Details Curable organopolysiloxane composition and a semiconductor... Curable organopolysiloxane composition and a semiconductor...

2007-10-16

2007-10-16

Zimmer, Marc S. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of silicon containing

C525S477000, C525S478000, C528S015000, C528S031000, C528S032000, C528S043000

Reexamination Certificate

active

10530693

ABSTRACT:
A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

REFERENCES:
patent: 6001943 (1999-12-01), Enami et al.
patent: 6225433 (2001-05-01), Isshiki et al.
patent: WO 01/17570 (2001-03-01), None

Affiliated with

Also associated with

Rating

Curable organopolysiloxane composition and a semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curable organopolysiloxane composition and a semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable organopolysiloxane composition and a semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3847077