Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...
Patent
1998-02-03
2000-04-11
Zitomer, Fred
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Polymers from only ethylenic monomers or processes of...
5263292, 5263293, 526330, 526332, 526342, 526242, 526279, 52631841, 52631842, 525303, C08F22010, C08F22018
Patent
active
060489537
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a liquid resin composition which can form a film and give a cured film without using a solvent, as a resin for a film-forming material such as an ink or for an adhesive. Further, the present invention relates to a liquid resin composition containing an acrylic liquid resin and a (meth)acrylic monomer, which can be used as a vehicle for a printing ink, a coating composition, an adhesive, or the like, used as a radiation-curable resin composition.
TECHNICAL BACKGROUND
Conventionally, a coating composition, an adhesive, an adhesive mass, an ink, a filler and a molding material contain resin solutions containing organic solvents. These resin solutions dissipate large amounts of organic solvents in the steps of coating and charging and in the steps of curing and drying. With increasing concerns about global environments and working environments, restrictions have come to be imposed on the use of the above resin solutions. one of methods for overcoming the above problem uses an aqueous solution of a resin, a powder or a hot-melt material. However, an aqueous solution of a resin contains an organic solvent to some extent for improving coating properties, and it can hardly be said that the aqueous solution of a resin is free of an odor in a working environment. Further, not only it is required to incinerate a discharged organic solvent, but also the disposal of its effluent requires an investment. In a coating or charging plant having large-scale equipment for the treatment of discharged gas, the release of an organic solvent to atmosphere can be prevented, while a small-scale plant having no such equipment has a problem that an effluent containing an organic solvent cannot be treated. The coating or charging of a powder or a holt melt requires equipment and a method which are quite different from conventional ones, and it is therefore required to introduce new equipment. For overcoming the above problems, attempts are being made to form a high-solid resin solution and to improve an aqueous solution of a resin, and it is considered that the amount of a resin solution remarkably tends to decrease owing to the above efforts. As an essential solution, however, it is strongly desired to develop a solventless liquid resin which is free from problems concerning pollution, hygienic safety, ignition, explosion, etc., which can be widely applied and which can be easily applied. Further, the solventless liquid resin is required to form a cured film or a shaped article by means of a conventional drying appratus.
Further, concerning a conventional radiation-curable resin composition, its viscosity is controlled by incorporating a large amount of a component having a low molecular weights However, the incorporation of a component having a low molecular weight is not desirable in view of a working environment since it causes problems of odor, etc. There are further another problems that a volume shrinkage takes place at a curing time and a cured film becomes fragile. For improving the curing-caused shrinkage ratio, attempts have been made to use a monomer component having a relatively high molecular weight or to add a component having a high molecular weight. However, since the latter component is in the state a solid, the amount of the component that can be added is limited in order to keep the viscosity of the composition in a proper range. Further, there are problems caused by a large content of a compound having a low molecular weight such as a problem on an odor caused by a residual monomer, and these problems limit the radiation-curable resin composition in use.
JP-A-57-171 discloses a technique concerning a solventless resin composition. This technique uses a liquid resin containing an acrylic monomer, while the technique is desired to be further improved since an obtained resin is an oligomer. Further, in view of physical properties, it is known that it is difficult to control the physical properties of a cured film obtained from a coating composition containing a res
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Patent Abstracts of Japan, 13(197) (P-868), abstract of JP 1-018142 (May 1989).
Horiuchi Kunio
Kawashima Miki
Tanaka Hiroaki
Sarofim N.
Toyo Ink Manufacturing Co. Ltd.
Zitomer Fred
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