Curable epoxy resin compositions

Details Curable epoxy resin compositions Curable epoxy resin compositions

1981-03-12

1983-03-08

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523400, C08L 6300

Patent

active

043761747

ABSTRACT:
The invention provides a novel curable epoxy resin composition suitable for resin encapsulation of various electronic devices such as transistors, ICs, LSIs and the like with high anti-moisture resistance and without causing excessive stress upon curing to the electronic devices. The resin composition comprises an epoxy resin, a curing agent such as a phenol novolac resin, a filler and a curing catalyst such as an imidazole compound as well as an organosilicon polymer represented by the general formula ##STR1## in which R is a monovalent hydrocarbon group such as methyl, Z is a divalent organic group such as ethylene and phenylene, n is a positive number of at least 10 on an average and a and b are each zero or a positive number not exceeding 1 with the proviso that a+b is in the range from 1 to 2 inclusive, in a limited amount.

REFERENCES:
patent: 3838094 (1974-09-01), Sporck
patent: 3843577 (1974-10-01), Keil
patent: 3926885 (1975-12-01), Keil
patent: 4082719 (1978-04-01), Liles et al.
patent: 4271061 (1981-06-01), Suzuki et al.

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