Curable epoxy resin compositions

Details Curable epoxy resin compositions Curable epoxy resin compositions

1981-03-12

1982-05-04

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 89, C08L 6300

Patent

active

043281508

ABSTRACT:
The invention provides a novel epoxy-based curable resin composition suitable for encapsulation of electronic devices such as transistors, ICs, LSIs and the like. The composition comprises an epoxy compound, a novolac-type phenolic resin as the curing agent, an organophosphine compound such as triphenylphosphine and trilaurylphosphine as a curing accelerator and an inorganic filler. The advantages obtained by the combined use of the novolac-type phenolic resin and the organophosphine compound are very specific and the resin composition is imparted with remarkable flowability in molding and stability in storage in addition to the excellent electric properties at high temperatures and anti-moisture resistance of the cured shaped articles molded therefrom.

REFERENCES:
patent: 2768153 (1956-10-01), Shokal
patent: 3759866 (1973-09-01), Rogers, Jr. et al.

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