Curable epoxy resin composition

Details Curable epoxy resin composition Curable epoxy resin composition

2006-09-12

2006-09-12

Zimmer, Marc S. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C523S427000, C523S445000, C523S458000, C523S468000, C523S433000, C524S266000, C524S268000, C525S476000, C528S503000

Reexamination Certificate

active

07105614

ABSTRACT:
A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

REFERENCES:
patent: 5516858 (1996-05-01), Morita et al.
patent: 5891969 (1999-04-01), Mine et al.
patent: 5952439 (1999-09-01), Morita et al.
patent: 2003/0152776 (2003-08-01), Kiuchi et al.
patent: WO 01/42360 (2001-06-01), None

Affiliated with

Also associated with

Rating

Curable epoxy resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curable epoxy resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable epoxy resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3562154