Curable compositions

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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C528S094000, C528S403000

Reexamination Certificate

active

10607111

ABSTRACT:
Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.

REFERENCES:
patent: 4607091 (1986-08-01), Schreiber
patent: 4806267 (1989-02-01), Culbertson et al.
patent: 5021484 (1991-06-01), Schreiber et al.
patent: 5200452 (1993-04-01), Schreiber
patent: 5443911 (1995-08-01), Schreiber et al.
patent: 5543516 (1996-08-01), Ishida
patent: 6207786 (2001-03-01), Ishida et al.
patent: 6323270 (2001-11-01), Ishida et al.
patent: 6429157 (2002-08-01), Kishi et al.
patent: 6534179 (2003-03-01), Japp et al.
patent: 6620905 (2003-09-01), Musa
patent: 2003/0018131 (2003-01-01), Davis et al.
patent: 2005/0042961 (2005-02-01), Lehmann et al.
patent: 9411852.5 (2000-10-01), None
patent: 0 458 739 (1991-04-01), None
patent: 0 518 060 (1992-05-01), None
patent: 0 323 142 (1993-09-01), None
patent: 1 408 152 (2004-01-01), None
patent: 1 415 782 (2004-05-01), None
patent: 06 345898 (1994-12-01), None
patent: 10 3010678 (1998-11-01), None
patent: 1259830 (1999-06-01), None
patent: 2000 273291 (2000-10-01), None
patent: 2003 082117 (2003-03-01), None
patent: WO 03/013820 (2003-02-01), None
T. Agag, et al, “Effect of Hydroxyphenylmaleimide on the Curing Behaviour and Thermomechanical Properties of Rubber-Modified Polybenzoxazine”, Institute of Physics Publishing, High Perform. Polym., 13, S327-S342 (Dec. 2001).
S. Rimdusit and H. Ishida, “Development of New Class of Electronic Packaging Materials Based on Ternary System of Benzoxazine, Epoxy, and Phenolic Resin,” Polymer, 41, 7941-49 (2000)Dec. 2000.
H. Ishida and D. Allen, “Mechanical Characterization of Copolymers based on Benzoxazine and Epoxy”, Polymer, vol. 37, No. 20, pp. 4487-4495 (Dec. 1996).
H. Ishida and Y. Rodriguez, “Curing Kinetics of a New Benzoxazine-Based Phenolic Resin by Differential Scanning Calorimetry”, Polymer, vol. 36, No. 16, pp. 3151-3158 (1995)Dec. 2000.
H. Kim and H. Ishida, “A Study on Hydrogen-Bonded Network Structure of Polybenzoxazines” J. Phys. Chem. A 106, pp. 3271-3280 (2002).
X. Liu and Y. Gu, “Study on the Volumetric Expansion of Benzoxazine Curing with Different Catalysts”, J. Appl. Sci., vol. 84, pp. 1107-1113 (2001)Dec. 2000.
S. Rimdusit and H. Ishida, “Gelation Study of High Processability and High Reliability Ternary Systems based on Benzoxazine, Epoxy, and Phenolic Resins for an Application as Electronic Packaging Materials”, Rheol Acta 41, pp. 1-9 (Dec. 2002).
H. Kim, H. Ishida, “Study on the Chemical Stability of Benzoxazine-Based Phenolic Resins in Carboxylic Acids”, J. Appl. Polym. Sci., vol. 79, pp. 1207-1219 (Dec. 2001).
H. Ishida, D. J. Allen, “Gelation Behavior of Near-Zero Shrinkage Polybenzoxazines”, J. Appl. Polym. Sci., vol. 79, 406-417 (2001)Dec. 2000.
H. Ishida, D.P. Sanders, “Improved Thermal and Mechanical Properties of Polybenzoxazines Based on Alkyl-Substituted Aromatic Amines”, J. Polym. Sci.: Part B, vol. 38, pp. 3289-3301 (2000)Dec. 2000.
H. Ishida, D.P.Sanders, “Regioselectivity and Network Structure of Difunctional Alkyl-Substituted Aromatic Amine-Based Polybenzoxazines”, Macromolecules, 33, 8149-8157 (2000)Dec. 2000.
S. B. Shen and H. Ishida, “Dynamic Mechanical and Thermal Characterization of High-Performance Polybenzoxazines”, J. Polym. Sci.: Part B Polym. Phy., vol. 37, 3257-3268 (1999) Dec. 1999.
S. Rimdusit and H. Ishida, “Synergism and Multiple Mechanical Relaxations Observed in Ternary Systems Based on Benzoxazine, Epoxy, and Phenlic Resins”, J. Polym. Sci: Part B: Polym. Phy., vol. 38, 1687-1698 (2000) Dec. 2000.
J. Dunkers, H. Ishida, “Reaction of Benzoxazine-based Phenolic Resins with Strong and Weak carbonxylic Acids and Phenols as Catalysts”, J. Polym. Sci.: Part A: Polym. Chem., vol. 37, 1913-1921 (1999) Dec. 1999.
X. Zhang, A. C. Potter and D. H. Solomon, “The Chemistry of Novolac Resins—V. Reactions of Benzoxazine Intermediates”, Polymer, vol. 39, 399-404 (Dec. 1998).
X. Zhang and D. H. Solomon, “The Chemistry of Novolac Resins—VI. Reactions Between Benzoxazine Intermediates and Model Phenols”, Polymer, vol. 39, No. 2, pp. 405-412 (1998) Dec. 1998.
Y. Wang and H. Ishida, “Devolopment of Low-Viscosity Benzoxazine Resins and Their Polymers”, J. Appl. Polym. Sci., vol. 86, pp. 2953-2966 (Dec. 2002).
K. Hemvichian and H. Ishida, Thermal Decomposition Processes in Aromatic Amine-Based Polybenzoxazines Investigated by TGA and GC-MS, Polymer, vol. 43, pp. 4391-4402 (2002) Dec. 2002.
B.M. Culbertson, “Cyclic Imino Ethers in Step-Growth Polymerizations”, Prog. Polym. Sci., Article in Press (2001) Dec. 2001.
H. Kimura, S. Taguchi, A. Matsumoto, “Studies on New Type of Phenolic Resin (IX) Curing Reaction of Bisphenol A-Based Benzoxazine with Bisoxazoline and the Properties of the Cured Resin. II. Cure Reactivity of Benzoxazine”, J. Appl. Polym. Sci., vol. 79, 2331-2339 (2001) Dec. 2001.
P. Chutayothin, H. Ishida, and S. Rowan, “Cationic Ring-Opening Polymerization of Monofunctional Benzoxazine”, Polymer Reprints, 42(2), pp. 599-600,621-622 (Dec. 2001).
T. Agag and T. Takeichi, “Novel Benzoxazine Monomers Containing p-Phenyl Propargyl Ether: Polymerization of Monomers and Properties of Polybenzoxazines”, Macromolecules, 34, pp. 7257-7263 (2001) Dec. 2001.
H. Kimura, et al., “New Thermosetting Resin from Poly(p-vinylphenol) Based Benzoxazine and Epoly Resin”, J. Appl. Polym. Sci, vol. 79, 555-565 (Dec. 2001).
A. S. C. Lim, et al., “Chemistry of Novolac Resins. X. Polymerization Studies of HMTA and Strategically Synthesized Model Compounds”, J. of Polym. Sci.: Part A: Polym. Chem., vol. 37, 1347-1355 (1999) Dec. 1999.
H. Y. Low and H. Ishida, “Mechanistic Study on the Thermal Decomposition of Polybenzoxazines: Effects of Aliphatic Amines”, J. of Polym. Sci.: Part B: Polym. Phy., vol. 36, pp. 1935-1946 (1998) Dec. 1998.
H. Kimura, et al., “Epoxy Resin Cured by Bisphenol A. Based Benzoxazine”, J. of Appl. Polym. Sci., vol. 68, 1903-1910 (1998) Dec. 1998.
J. E. McGrath, et al., “Syntheses and Characterizatio of Segmented Polyimide-Polyorganosiloxane Copolymers”, Adv. in Polym. Sci., vol. 140, pp. 61-105 (Dec. 1999).
ULTEM 2000 (CAS Reg. No. 61128-46-9) (2003) Dec. 2003.
W. J. Burke, et al., “A new Aminoalkylation Reation. Condensation of Phenols with Dihydro-1, 3-Aroxazines”, J. Org. Chem., vol. 30(10), pp. 3423-3427 (Dec. 1965).
J. Jang and D. Seo, “Performance Improvement of Rubber-Modified Polybenzoxazine”, J. Appl. Polym. Sci., vol. 67, pp. 1-10 (1998) Dec. 1998.
Raymond A. Pearson, “Toughening Epoxies Using Rigid Thermoplastic Particles”, American Chemical Society, pp. 405-425 (1993) Dec. 1993.
N. Dansiri, et al., “Resin Transfer Molding of Natural Fiber Reinforced Polybenzoxazine Composities”, J. Soc. of Plast. Engs., 23(3), 352-360, (Dec. 2002).
Y. Gu, et al., “New Matrix based on Benzoxazine for Resin Transfer Molding (RTM and their Composites”,Fuhe Cailiao Xuebao, 17(4), 32-37 (2000) (Abstract) Dec.
J. Jang, et al. “Toughness Improvement of Carbon-Fibre/Polybenzoxazine Composites by Rubber Modification”,Composites Sci. and Tech., 60, 3, 457-463 (2000) (Abstract) Dec. 2000.
T. Takeichi, et al, “Synthesis and Properties of Polybenzoxazine Based Composites”, Recent Res. Devel. Polymer Science, 4, 85-105 (Dec. 2000).

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