Curable composition containing a difunctional epoxy resin, a pol

Details Curable composition containing a difunctional epoxy resin, a pol Curable composition containing a difunctional epoxy resin, a pol

1987-11-16

1989-09-19

Kight, John

Stock material or miscellaneous articles

Composite

Of epoxy ether

428418, 525482, 528 88, 528 89, 528 90, 528 91, 528 93, 528 94, 528 98, 528 99, 528102, 528103, C08G 5962

Patent

active

048680591

ABSTRACT:
Electrical laminates are prepared from prepreg materials prepared by impregnating a substrate with a laminating varnish comprising a solvent solution of a curable composition comprising (A) a mixture of at least one epoxy resin having an average of more than 1 but not more than 2 vicinal epoxy groups per molecule and at least one epoxy resin having an average of more than 2 vicinal epoxy groups per molecule; (B) a mixture of at least one phenolic hydroxyl-containing compound having an average of more than 1 but not more than 2 phenolic hydroxyl groups per molecule and at least one phenolic hydroxyl-containing compound having an average of more than 2 phenolic hydroxyl groups per molecule; and (C) at least one catalyst for effecting the reaction between (A) and (B).

REFERENCES:
patent: 3493630 (1970-02-01), Salensky
patent: 3738862 (1973-06-01), Klarquist et al.
patent: 3931109 (1976-01-01), Martin
patent: 4186036 (1980-01-01), Elms et al.
patent: 4322456 (1982-03-01), Martin
patent: 4440914 (1984-04-01), Helfand et al.
patent: 4549000 (1985-10-01), Widmer et al.
patent: 4604317 (1986-08-01), Berman et al.
Agreement dated 7-2-86 with IBM.

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