Curable composition and multilayered circuit substrate

Details Curable composition and multilayered circuit substrate Curable composition and multilayered circuit substrate

2005-10-18

2005-10-18

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S258000, C524S553000, C524S554000, C524S556000, C524S589000, C524S595000, C524S606000, C524S612000, C523S451000, C523S452000

Reexamination Certificate

active

06955848

ABSTRACT:
This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.

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