Cup type plating apparatus

Details Cup type plating apparatus Cup type plating apparatus

2006-01-31

2006-01-31

King, Roy (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

Reexamination Certificate

active

06991711

ABSTRACT:
A cup type plating apparatus in which plating is carried out by supplying plating solution to a wafer placed on an opening at a top of a plating tank while an anode and the wafer connected to a cathode provided in the plating tank are electrically connected, and the anode and the cathode are separated by diaphragm provided in the plating tank, provided with a division wall between the anode and the wafer formed in a shape capable of separating the anode and the wafer from each other and having a plurality of openings covered with diaphragm. The concentration of the plating solution supplied to the plating tank separated by the division wall is made to be appropriately controllable. Further, a unit for stirring is provided capable of forcibly altering the flow of plating solution at the target surface of plating.

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