Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating process fluid by means other than agitation or...
Reexamination Certificate
2007-02-20
2007-02-20
Wilkins, III, Harry D. (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating process fluid by means other than agitation or...
C204S237000, C204S275100, C204S238000, C205S099000
Reexamination Certificate
active
10473962
ABSTRACT:
Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed. If the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be adjusted, it is possible to suppress nonuniform plating and variations in plating on a plating target surface by adjusting the shape and/or opening area.
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English translation of JP 04-056799 A.
Sakaki Yasuhiko, “Cup Type Plating Apparatus”, Patent Abstracts of Japan, Publication No. 2002-173794, Date of Publication of Application: Jun. 21, 2002.
Tachihaba Yoshito Nobata Hiroyoshi, “Plating Treatment Device”, Patent Abstracts of Japan, Publication No. 2000-345386, Date of Publication of Application: Dec. 12, 2000.
Kato Kazuo, et al., “Plating Solution Circulating Device for Continuous Electroplating Device”, 2 pages.
Ishida Hirobumi, “Plating Method and Plating Device”, Patent Abstracts of Japan, Publication No. 2002-322589, Date of Publication of Application: Nov. 8, 2002.
Electroplating Engineers of Japan, Ltd
Roberts & Roberts, LLP
Wilkins, III Harry D.
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