Cubic boron nitride composite structure

Details Cubic boron nitride composite structure Cubic boron nitride composite structure

1993-12-02

1998-11-10

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

H02G 308, H05K 502

Patent

active

058346899

ABSTRACT:
The present invention pertains to a composite structure comprised of a matrix material, such as metal, and a plurality of cubic boron nitride particles dispersed within and surrounded by the matrix material. In a first embodiment, the composite structure is used as an electronic package to house an electrical device such as an integrated chip. The cubic boron nitride particles are dispersed within the matrix material in proportion such that the coefficient of thermal expansion of the package essentially matches that of the electronic devices. In another embodiment, the composite structure can be used as a thermal conductor, such as a heat sink. Since cubic boron nitride particles have the highest thermal conductivity of any ceramic, they act in combination with the matrix metal to transfer heat efficiently. In another embodiment, the composite structure can be used as a component subject to attrition. The cubic boron nitrides offer unexcelled wear resistance and transfer the heat efficiently.

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