Cube-like processor array architecture

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364229, 3642319, 36493101, 3649314, 36494061, 36494064, 364DIG2, G06F 15163, G06F 1516

Patent

active

054308879

ABSTRACT:
According to the present invention, a 3D connectivity-conserved grain-structured processing architecture uses connectable massively parallel processors. A 3D grain-structured processing architecture is provided. The 3D links of the grain-structured processing architecture provide direct local communication as well as global communication for voxel processing and analysis tasks. A novel transport naming scheme which is scalable in any three-dimension direction and the local/global communication protocol are disclosed. The 3D volumetric data set is first divided into a set of voxel sub-cubes. Each voxel subcube is processed by a processor element of the grain-structured processing architecture. Data discontinuity is produced after performing local operations in a massively parallel processors environment and requires replacing the resulted voxel data set in the overlap region for each voxel sub-cube. An inter-processor communication procedure for overcoming this problem in the 3D connected grain-structured processors architecture is also disclosed.

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