Cu—Ni—Si—Co—Cr copper alloy for...

Details Cu—Ni—Si—Co—Cr copper alloy for... Cu—Ni—Si—Co—Cr copper alloy for...

2006-03-31

2011-12-06

Ip, Sikyin (Department: 1735)

Metal treatment

Stock

Copper base

C148S414000, C148S681000, C148S682000, C420S485000, C420S486000, C420S487000, C420S488000

Reexamination Certificate

active

08070893

ABSTRACT:
The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5≦Ni/Co≦about 2, and wherein Pc is equal to or less than about 15/1000 μm2, or Pc/P is equal to or less than about 0.3 wherein P is the number of inclusions dispersed in the alloy and having the size of 1 μm or more, and Pc is the number of inclusions, among those having the size of 1 μm or more, whose carbon concentration is 10% or more by weight.

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Chem Abstract 145:402149, abstracting JP2006283059 (Oct. 19, 2006).
Chem Abstract 141:414240, abstracting JP2004315940 (Nov. 11, 2004).
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