CSP Semiconductor device having signal and radiation bump...

Details CSP Semiconductor device having signal and radiation bump... CSP Semiconductor device having signal and radiation bump...

2005-01-11

2005-01-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S734000, C257S784000, C257S786000, C257S778000, C257S349000, C257S459000, C257S759000, C257S700000, C257S701000, C257S782000

Reexamination Certificate

active

06841873

ABSTRACT:
A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a conductive film which is formed on the insulating film and the pad, a sealing material which covers a part of the conductive film and the insulating film and a bump which is formed over the conductive film, wherein the bump is exposed from a surface of the sealing material.

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