CSP plate cutting apparatus

Details CSP plate cutting apparatus CSP plate cutting apparatus

1999-11-02

2001-06-26

Rachuba, M. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S010000, C451S011000, C125S013010, C125S023010

Reexamination Certificate

active

06250990

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus for cutting and separating (hereinafter referred as “pelletizing”) CSP plates into their individual chip scale packages (abbreviated as CSPs) or pellets to put them on carrier trays for transportation.
2. Related Arts
Referring to
FIG. 8
, a chip size package plate (abbreviated as CSP plate)
100
is composed of a lattice arrangement of semiconductor chips lined with epoxy or any other resin material in sealed integral form, which can be separated into a plurality of CSPs or pellets by cutting along crosswise cutting lines
101
and
102
.
Referring to
FIG. 9
, CSP plates
100
can be pelletized with a conventional dicing apparatus
110
, which is usually used in dicing semiconductor wafers. A plurality of CSP plates
100
each attached to a carrier F by means of adhesive tape T, are stored in a cassette
111
.
CSP plates
100
are taken out one after another by the taking-out means
112
, and then a selected CSP plate is sucked and held on the first transporting means
113
. When the first transporting means
113
turns toward the chuck table
114
, the CSP plate
100
is released and laid on the chuck table
114
where it is sucked and fixedly held.
The chuck table
114
is moved in the X-axial direction to the orientation stage where a picture of the CSP plate
100
is taken to locate its cutting lines
101
and
102
with the aid of the alignment means
116
. Then, the chuck table
114
is moved in the X-axial direction to permit the cutting means
118
to cut the CSP plate
100
along a selected longitudinal cutting line
101
with the cutting blade
117
.
After cutting the CSP plate
100
along all longitudinal cutting lines
101
, the chuck table
114
is rotated 90 degrees, and then the CSP plate
100
is cut along its lateral cutting lines
102
. When the CSP plate
100
is cut along all lateral cutting lines
102
, it is separated into a plurality of individual CSPs or pellets.
After being pelletized, the CSP plate
100
which has its individual pellets retained thereon, is transported to the washing area
120
where the separated CSP plate
100
is washed and dried, and then, the separated CSP plate is taken in the cassette
111
with the taking-in means
112
. Thus, the cassette
111
loaded with pelletized CSP plates, each lined with adhesive tape T and supported by an associated carrier F, is removed from the dicing apparatus
110
. Later, individual CSPs are put in carrier trays to be arranged at regular intervals therein, and the carrier trays thus loaded with individual CSPs are shipped or transported to assembling lines in the factory.
After dicing semiconductor wafers, the so produced pellets must be subjected to wire-bonding, packaging and other processing before providing commercial products. Different from such semiconductor wafers CSP plates can be advantageously commercial products simply by pelletizing. It is, however, necessary that such pellets are put in carrier trays for shipping or transporting to the assembling lines of an electronics manufacturing factories.
If the dicing apparatus
110
is used in pelletizing CSP plates, the plates can be pelletized, and the so pelletized CSP plates can be put in the cassette, but disadvantageously individual CSPs cannot be put in carrier trays for shipping. For that purpose it is necessary that such individual pellets be transported to a loading stage where they are put in carrier trays by using loading means. This requires not only such extra loading means but also operators engaging in loading work.
SUMMARY OF THE INVENTION
One object of the present invention is to provide an apparatus which is capable of pelletizing CSP plates and loading carrier trays with individual CSPs or pellets for shipping, thereby improving the productivity of CSPs and substantially reducing the cost involved for packaging for shipping.
To attain this object according to the present invention an apparatus for dicing CSP plates into individual pellets to put them on carrier trays for transportation comprises at least: a jig rack for storing a plurality of jigs for holding CSP plates; table means for taking a selected jig out from the jig rack to carry and transport it to a CSP plate Storage area in which CSP plates are brought and laid one after another; a cassette table on which a CSP plate cassette is put; means for taking a selected CSP plate out from the cassette; means for putting the so taken-out, selected CSP plate on an associated jig, which is laid on the jig taking-out table means; first transporting means for transporting the CSP plate-and-jig combination from the jig taking-out table means to a working table; means for cutting and separating the CSP plate with a cutting blade, the CSP plate-and-jig combination being held on the working table; second transporting means for transporting the jig holding its CSP plate cut and separated into individual pellets from the working table to a washing table; third transporting means for transporting the so washed cut CSP plate-and-jig combination from the washing table to a pellet picking-up table; means for picking up individual pellets from the pellet picking-up table to put them in carrier trays, which are laid in a pellet transferring area; and fourth transporting means for transporting empty jigs from the pellet picking-up table to the jig taking-out table means.
With this arrangement CSP plates can be pelletized and carrier trays can be loaded with CSPs or pellets in one and same apparatus, requiring neither extra loading site nor operators engaging in loading work.
The pelletizing-and-loading apparatus may further comprise:
a first tray rack for storing empty carrier trays; a second tray rack for storing pellet-loaded carrier trays; a first tray- carrying table for transporting empty carrier trays from the first tray rack to the pellet transferring area; a second tray-carrying table for transporting pellet-loaded carrier trays to the second tray track; and means for transferring pellet-loaded carrier trays from the first tray-carrying table to the second tray-carrying table.
Each jig may have slots or grooves made in the form of lattice on its surface, thereby allowing the cutting blade to traverse the jig without being caught when the overlying CSP plate is being cut, each square defined by the lattice pattern having a first suction through-hole and second suction holes made therein, the first suction through-hole passing through the thickness of the jig to communicate with a suction source provided to the working table, whereas the second suction holes communicate with vent holes made on selected sides of the jig for inserting suction pipes extending from the suction source via the conduit passages made in the first, second and third transporting means, thereby permitting the CSP plate to be held on the jig by suction.
The suction pipes extending from the first, second and third transporting means are adapted to apply negative pressure to selected CSP plates and at the same time, physically pinch the jig therebetween for holding the same.
Other objects and advantages of the present invention will be understood from the following description of a cutting-and- loading apparatus according to one embodiment of the present invention, which is shown in accompanying drawings.


REFERENCES:
patent: 5842461 (1998-12-01), Azuma
patent: 6102023 (2000-08-01), Ishiwata et al.
patent: 11-267940 (1999-10-01), None

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