Crystallization apparatus, crystallization method, device,...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S492100, C250S492200, C250S492230, C117S092000, C117S103000, C359S619000, C359S624000, C359S626000

Reexamination Certificate

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07897946

ABSTRACT:
A crystallization apparatus includes a light modulation element, and an image forming optical system that forms a light intensity distribution set based on light transmitted through the light modulation element on an irradiation surface. The crystallization apparatus irradiates a non-single crystal semiconductor film with light having the light intensity distribution to generate a crystallized semiconductor film. A curvature radius of at least one isointensity line of a light intensity substantially varies along the isointensity line in the light intensity distribution on the irradiation surface, and a curvature radius of at least a part of the isointensity line has a minimum value of 0.3 μm or below.

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Masakiyo Matsumura, “Preparation of Ultra-Large Grain Silicon Thin-Films by Excimer-Laser”, Journal of the Surface Science Society of Japan, vol. 21, No. 5, May 2000, pp. 32-41.
U.S. Appl. No. 12/417,838, filed Apr. 3, 2009, Taniguchi, et al.

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