Crystallization apparatus and crystallization method

Single-crystal – oriented-crystal – and epitaxy growth processes; – Apparatus – With means for measuring – testing – or sensing

Reexamination Certificate

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C117S200000, C117S202000, C117S900000, C117S904000, C117S905000, C250S206100, C430S005000

Reexamination Certificate

active

07572335

ABSTRACT:
A crystallization apparatus includes an illumination system which illuminates a phase-shift mask and an image-forming optical system arranged in an optical path between the phase-shift mask and a semiconductor film. The semiconductor film is irradiated with a light beam having a light intensity distribution of inverted peak patterns whose light intensity is the lowest in portions corresponding to phase shift sections to form a crystallized semiconductor film. The image-forming optical system is located to optically conjugate the phase-shift mask and the semiconductor film and has an aberration corresponding to the given wavelength range to form a light intensity distribution of inverted peak patterns with no swell of intensity in the middle portion.

REFERENCES:
patent: 6377336 (2002-04-01), Shiraishi et al.
patent: 6734635 (2004-05-01), Kunii et al.
patent: 6746942 (2004-06-01), Sato et al.
patent: 7345746 (2008-03-01), Takami
patent: 1 047 119 (2000-10-01), None
patent: 2000-306859 (2000-11-01), None
Chang-Ho OH, Motohiro Ozawa and Masakiyo Matsumura, A Novel Phase-Modulated Excimer-Laser Crystallization Method of Silicon Thin Films, Jpn. J. Appl. Phys. vol. 37 (1998), Part 2, No. 5A, May 1, 1998 @ 1998 Publication Board, Japanese Journal of Applied Physics, pp. L492-L495.
Masakiyo Matsumura, Preparation of Ultra-Large Grain Silicon Thin-Films by Excimer-Laser, vol. 21, No. 5, pp. 278-287, 2000, Mar. 28, 2000, pp. 34-43.

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