Crystallization apparatus and crystallization method

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from solid or gel state

Reexamination Certificate

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C117S005000, C117S008000, C117S009000, C117S201000, C117S202000

Reexamination Certificate

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10724261

ABSTRACT:
A crystallization apparatus includes an illumination system which illuminates a phase shifter having a phase shift portion, and irradiates a polycrystal semiconductor film or an amorphous semiconductor film with a light beam having a predetermined light intensity distribution in which a light intensity is minimum in a point area corresponding to the phase shift portion of the phase shifter, thereby forming a crystallized semiconductor film, the phase shifter has four or more even-numbered phase shift lines which intersect at a point constituting the phase shift portion. An area on one side and an area on the other side of each phase shift line have a phase difference of approximately 180 degrees.

REFERENCES:
patent: 2002/0047580 (2002-04-01), Kunii et al.
patent: 2006/0019503 (2006-01-01), Takami
Masakiyo Matsumura, “Preparation of Ultra-Large Grain Silicon Thin-Films by Excimer-Laser”. Surface Science, vol. 21, No. 5, Mar. 2000, pp. 278-287.
M. Nakata, et al., “Two-Dimensionally Position-Controlled Ultra-Large Grain Growth Based on Phase-Modulated Excimer-Laser Annealing Method”, Electrochemical Society Proceedings, vol. 2000-31, pp. 148-153.
Mitsuru Nakata, et al., “A New Nucleation-Site-Control Excimer-Laser-Crystallization Method”, Japanese Journal of Applied Physics, Part 1 Regular Papers, Short Notes & Review Papers, vol. 45 No. 5A, May 2001, pp. 3049-3054.
Chang-Ho Oh, Optimization of phase-modulated excimer-laser annealing method for growing highly-packed large-grains in Si thin-films, Applied Surface Science 154-155, 2000, pp. 105-111.
M. Matsumura, Advanced Laser-Crystallization Technologies of Si for High-Performance TFTs, ALTEDEC, pp. 263-266.

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