Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1996-03-07
1999-08-03
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438 64, H01L 2144
Patent
active
059337079
ABSTRACT:
This disclosure relates to the fabrication of components on a single crystal substrate. A method is disclosed of overcoming the problems encountered in defining etched features on a silicon substrate. In particular, there is disclosed a method of producing a multichip module comprising a silicon substrate having surface features for the placement of components. An organic dielectric is applied to the substrate prior to the use of an etchant whereby interconnects can be defined.
REFERENCES:
patent: 5302547 (1994-04-01), Wojnarowski et al.
Sudo, "A Silicon-Based Multichip Module with Co-Fired Aluminum Nitride Package", IEICE Transactions, vol. E74, No. 8, Aug. 1991, pp. 2323-2330.
Ayliffe Peter John
Geear Martin Christopher
Harcourt Roger William
Harrison Paul Mark
Parker James Wilson
Northern Telecom Limited
Picardat Kevin M.
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