Crystal devices and methods for manufacturing same

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S367000

Reexamination Certificate

active

07932662

ABSTRACT:
Crystal devices are disclosed that include a crystal frame having a crystal vibrating piece and an outer frame. The crystal vibrating piece includes excitation electrodes, and the outer frame supports the crystal vibrating piece. Each device has a base including connection electrodes on a first surface thereof and respective external electrodes on a second surface thereof, wherein the connection electrodes are electrically connected via respective through-holes to respective excitation electrodes and to respective external electrodes. The first surface of the base is bonded to the under-surface of the outer frame, and an upper surface of the outer frame is bonded to a crystal lid. The through-holes have non-circular transverse profiles and are filled with a sealing material such as a metal.

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Extended European Search Report for corresponding European Application No. 09150473.8, European Patent Office, Oct. 16, 2009, 4 pages.
Tong et al., “Low Temperature Wafer Direct Bonding,”J. Microelectromech. Syst., 3(1):29-35 (1994).
Office Action issued in corresponding JP Patent Application No. JP 2008-005228.

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