Cryotreatment device and method of forming conduction blocks

Surgery – Instruments – Cyrogenic application

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C606S023000

Reexamination Certificate

active

08048066

ABSTRACT:
Cryotreatment devices and methods of ablating tissue within the body are disclosed. A cryotreatment device in accordance with an exemplary embodiment of the present invention includes an elongated member having one or more needle-like ablation tips configured to induce necrosis at a target site within the heart. A cooling fluid such as a cryogen may be injected through a lumen extending into the distal portion of the device. The ablation tips can be configured to pierce and ablate surrounding tissue, blocking electrical stimuli that can cause fibrillations or other arrhythmias of the heart. The device may also include means for controlling the transmural depth at which the ablation tips are inserted into the cardiac tissue. Methods of forming a contiguous line of conduction block in accordance with the present invention are also disclosed.

REFERENCES:
patent: 3298371 (1967-01-01), Lee
patent: 3782386 (1974-01-01), Barger et al.
patent: 3913581 (1975-10-01), Ritson-Upavon et al.
patent: 4015606 (1977-04-01), Mitchiner
patent: 4207897 (1980-06-01), Lloyd et al.
patent: 4924679 (1990-05-01), Brigham
patent: 5078713 (1992-01-01), Varney
patent: 5147355 (1992-09-01), Friedman et al.
patent: 5254116 (1993-10-01), Baust et al.
patent: 5281213 (1994-01-01), Milder et al.
patent: 5281215 (1994-01-01), Milder
patent: 5334181 (1994-08-01), Rubinsky et al.
patent: 5403309 (1995-04-01), Coleman et al.
patent: 5403311 (1995-04-01), Abele et al.
patent: 5423807 (1995-06-01), Milder
patent: 5425582 (1995-06-01), Asano
patent: 5501681 (1996-03-01), Neuwirth
patent: 5624392 (1997-04-01), Saab
patent: 5674218 (1997-10-01), Rubinsky et al.
patent: 5688267 (1997-11-01), Panescu et al.
patent: 5716353 (1998-02-01), Matsuura
patent: 5733280 (1998-03-01), Avitall
patent: 5741248 (1998-04-01), Stern et al.
patent: 5743903 (1998-04-01), Stern
patent: 5759182 (1998-06-01), Varney
patent: 5807391 (1998-09-01), Wijkamp
patent: 5853368 (1998-12-01), Solomon et al.
patent: 5868735 (1999-02-01), Lafontaine
patent: 5885276 (1999-03-01), Ammar et al.
patent: 5893848 (1999-04-01), Negus et al.
patent: 5899898 (1999-05-01), Arless et al.
patent: 5951546 (1999-09-01), Lorentzen
patent: 5993444 (1999-11-01), Ammar et al.
patent: 6056743 (2000-05-01), Ellis et al.
patent: 6063082 (2000-05-01), DeVore et al.
patent: 6074412 (2000-06-01), Mikus et al.
patent: 6106518 (2000-08-01), Wittenberger et al.
patent: 6142991 (2000-11-01), Schatzberger
patent: 6161543 (2000-12-01), Cox et al.
patent: 6164283 (2000-12-01), Lesh
patent: 6237355 (2001-05-01), Li
patent: 6283959 (2001-09-01), Lalonde et al.
patent: 6290696 (2001-09-01), Lafontaine
patent: 6355029 (2002-03-01), Joye et al.
patent: 6451012 (2002-09-01), Dobak, III
patent: 6468268 (2002-10-01), Abboud et al.
patent: 6502576 (2003-01-01), Lesh
patent: 6506189 (2003-01-01), Rittman, III et al.
patent: 6527767 (2003-03-01), Wang
patent: 7147633 (2006-12-01), Chee et al.
patent: 7479139 (2009-01-01), Cytron et al.
patent: 2002/0040220 (2002-04-01), Zvuloni et al.
patent: 2003/0029462 (2003-02-01), Cox et al.
patent: WO 01/37919 (2001-05-01), None
Official Action in JP App. Ser. No. 2006-509805, mailed Nov. 10, 2009, 7 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cryotreatment device and method of forming conduction blocks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cryotreatment device and method of forming conduction blocks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cryotreatment device and method of forming conduction blocks will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4256153

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.