Cryogenic packaging scheme

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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29879, 165 804, 174 15CA, 357 83, 361413, 439179, H05K 720

Patent

active

047348208

ABSTRACT:
Apparatus and method for removably mounting an integrated circuit package having a plurality of electrical pins wherein a plurality of mating pins each having a receptacle filled with liquid mercury are connected to the electrical pins of the integrated circuit package and the temperature reduced such that the liquid mercury solidifies thereby firmly bonding the electrical pins together. The assembly may be inserted into a Dewar type vessel and covered with a low temperature liquified gas for the dual purpose of solidfying the liquid mercury and cooling the integrated circuit package.

REFERENCES:
patent: 411370 (1889-09-01), Barrett
patent: 1621381 (1927-03-01), Sinclaire
patent: 4302793 (1981-11-01), Rohner
patent: 4528530 (1985-07-01), Ketcher
Stackhouse, "Module Package with Heat Sink Between Substrate and Circuit Board", IBM Technical Disclosure Bulletin, vol. 22, No. 4, 9/79, pp. 1428-1429.
Rideout, "Close-Cycle Nitrogen Refrigeration System for Low-Temperature Computer Operation", IBM Technical Disclosure Bulletin, vol. 18, No. 4, 9/75, pp. 1226-1229.
Seely, "Cooling System", IBM Technical Disclosure Bulletin, vol. 11, No. 7, 12/68, p. 833.
Chu et al, "Thermal Card and Deflector System for Augmenting Emersion Cooling", IBM Technical Disclosure Bulletin, vol. 10, No. 10, 3/68, pp. 1559-1560.

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