Cryogenic insulation

Details Cryogenic insulation Cryogenic insulation

2007-10-02

2007-10-02

Peng, Kuo-Liang (Department: 1712)

Stock material or miscellaneous articles

Composite

Of silicon containing

C524S588000, C528S043000

Reexamination Certificate

active

10927978

ABSTRACT:
Putty-like gap-filling compounds for insulation that can be utilized at temperatures from about −420° F. (−250° C.) up to about 500° F. (260° C.) are described herein. Embodiments of these compounds contain about 25-50 volume percent base material, about 50-75 volume percent microspheres, and about 0.1-0.3 volume percent catalyst. Embodiments of these compounds contain about 70-80 weight percent base material, about 20-30 weight percent microspheres, and about 0.1-0.5 weight percent catalyst.

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patent: 2003/0152703 (2003-08-01), Hammond et al.
patent: 2003/0203149 (2003-10-01), Allen et al.

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