Cryogenic chip removal technique

Details Cryogenic chip removal technique Cryogenic chip removal technique

1979-11-13

1981-06-23

Lazarus, Richard B.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 13, 228 46, 294264, 294265, 225 935, B23K 2800

Patent

active

042745764

ABSTRACT:
A semiconductor chip mounted on a substrate by solder columns connecting one side of the chip to the substrate, is removed from the substrate by cooling the unconnected side of the chip to embrittle the solder columns and then twisting the chip with small angle rotational motion to shear the columns at their midpoints. A mechanism for cooling and rotating the chip makes use of the cooling substance to minimize the contact of the substrate with the cooling substance.

REFERENCES:
patent: 3556366 (1971-01-01), Kim
patent: 3969813 (1976-07-01), Minetti et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 3, Aug. 1976, pp. 939-940, "Cleaning of Solder Pads Prior to Reword Operation".

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