Semiconductor device manufacturing: process – Gettering of substrate – By vibrating or impacting
Patent
1998-03-31
2000-05-16
Niebling, John F.
Semiconductor device manufacturing: process
Gettering of substrate
By vibrating or impacting
438800, H01L 21322, H01L 2100
Patent
active
060636971
ABSTRACT:
A device for protecting semiconductor material includes a support and a surface made of ice formed from ultrapure water. Semiconductor material is situated on this support surface.
REFERENCES:
patent: 4820650 (1989-04-01), Nagae et al.
patent: 4883775 (1989-11-01), Kobayashi
patent: 5013693 (1991-05-01), Guckel et al.
patent: 5348893 (1994-09-01), Yamagishi
patent: 5443863 (1995-08-01), Neely et al.
patent: 5464480 (1995-11-01), Matthews
Flottmann Dirk
Schantz Matthaus
Wolf Reinhard
Lindsay Walter L.
Niebling John F.
Wacker-Chemie GmbH
LandOfFree
Crushing of silicon on ultrapure ice does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Crushing of silicon on ultrapure ice, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Crushing of silicon on ultrapure ice will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-258495