Crossover structure for microelectronic circuits

Details Crossover structure for microelectronic circuits Crossover structure for microelectronic circuits

1977-04-27

1979-02-20

Smith, John D.

Electricity: electrical systems and devices

Miscellaneous

174 685, 252 632, 252 635, 361411, 427 96, 428308, H05K 104

Patent

active

041410556

ABSTRACT:
Disclosed is a crossover structure and method of fabricating such structure which contributes low capacitance to the circuit performance. The crossover utilizes a dielectric material which includes spheres of an insulating material in order to separate the conductors. In one aspect of the invention, a UV curable epoxy including hollow glass spheres is deposited on the crosspoint areas and the crossover connector deposited thereon. In another aspect of the invention, the crossover is formed with an air gap and the gap is subsequently filled with an encapsulating material including the spheres.

REFERENCES:
patent: 2850687 (1958-09-01), Hammes
patent: 3461524 (1969-08-01), Lepselter
patent: 3670091 (1972-06-01), Frantz
patent: 3672985 (1972-06-01), Nathanson et al.
patent: 3681134 (1972-08-01), Nathanson et al.
patent: 3821611 (1974-06-01), Bacher
patent: 3830776 (1974-08-01), Carlson et al.
patent: 3988647 (1976-10-01), Bolon et al.
patent: 4000054 (1976-12-01), Marcantonio

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