Crosslinkable composition for coating substrates, coating proces

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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522121, 427487, 526271, 525297, 525303, 527311, C08F 246

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active

059360054

DESCRIPTION:

BRIEF SUMMARY
The present invention relates to a crosslinkable composition which can be applied for coating substrates, and to a coating process employing this composition and to the corresponding coated substrates.
The substrates in question are substrates of all kinds, both porous, like wood, and nonporous, like glass, metals or plastics, and both planar in shape and comprising relief or hollow regions or, more generally, of complex shapes giving rise to regions, called shadow regions, which cannot be reached by irradiation using UV lamps or electron beams under which the components to be coated are travelling. This is, for example, the case with wood exhibiting pores which open at the surface or complex mechanical items like engine components.
The technical requirements of the protective varnishes and coatings addressed by the present invention are very diverse and sometimes highly restrictive; they are generally the following: such as polycarbonate; tensile strength; substrates such as wood, and obtaining a complete crosslinking, it being known that, in the contrary case and with porous substrates, the remaining monomers can exude to the surface of the coating in the course of time, in particular with the disadvantage of producing an unpleasant odour; the shadow regions.
Until now a high level of these requirements has never been satisfied simply, economically and with respect for the environment and, in particular, on coatings applied to substrates comprising shadow regions, a hard-ness of the portion of the coating of the shadow region has not been obtained, it being possible, as indicated, for this shadow region to comprise thick regions in which the crosslinking under the effect of an irradiation is found to be difficult.
Patent Application JP-A-62/158710 discloses a photocrosslinkable composition which can be used especially for the manufacture of inks, including: 10 to 100% of the anhydride rings of a maleic anhydride-unsaturated hydrocarbon copolymer using a hydroxyalkylene (meth)acrylate; and 50 to 100% of the anhydride rings of a maleic anhydride-unsaturated hydrocarbon copolymer using a saturated compound containing a hydroxyl group; to 70% of the epoxy rings of an epoxidized phenolic resin using (meth)acrylic acid;
Patent Application JP-A-63/205649 discloses a photosensitive liquid composition which can be used as a soldering mask for printed circuits, including: a copolymer formed by at least 10 mol % of maleic anhydride and at most 90 mol % of monomer which is polymerizable by a radical route with 0.05 to 0.95 moles, per mole of anhydride, of alcohol and/or of monovalent epoxide which can be polymerized by a radical route and of an epoxide (b) chosen from bisphenol diglycidyl ether and epoxy resins of cresol-novolac or phenol-novolac type; radical route, containing no epoxy group; and
Hydroxyalkyl (meth)acrylates are mentioned among the monovalent alcohols which can form part of the composition of the ester (a). Glycidyl (meth)acrylate, allyl glycidyl ether and cyclohexenevinyl monoepoxide are mentioned among the monovalent epoxides which can form part of the composition of the ester (a).
Already known from Patent U.S. Pat. No. 5,114,830 is a composition, crosslinkable under the effect of a radiation, including from 15 to 40% by weight of a partial ester of a hydroxyalkyl (meth)acrylate and of a styrene-maleic anhydride copolymer, from 2 to 15% of a multi-functional (meth)acrylate monomer, from 3 to 12% of a photoinitiator and from 10 to 35% by weight of a multi-functional epoxide. This composition, intended for crosslinked soldering masks for printed circuits, makes it possible to solve the technical problems previously attributed to the postcuring (thermal crosslinking) stage which follows the crosslinking using irradiation. In fact, during the curing stage (at a temperature of 130.degree. to 170.degree. C.), a substantial proportion of the hydroxyalkyl (meth)acrylate groups dissociates from the polymer, thus regenerating maleic anhydride groups which can react with the multifunctional epoxide to perf

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