Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-21
2011-06-21
Pape, Zachary M (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S698000, C361S703000, C361S679530, C361S697000, C165S080400, C165S080500, C165S104330, C257S715000, C257S722000, C174S015100, C174S016300
Reexamination Certificate
active
07965511
ABSTRACT:
The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In an embodiment, the vapor configuration is modified to include fins that define a cross-flow heat exchanger where the vapor from the vapor chamber serves as the fluid in the vertical cross-flow in the heat exchanger and natural or forced cooling air serves as the horizontal cross-flow for the heat exchanger.
REFERENCES:
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4523636 (1985-06-01), Meijer et al.
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5386143 (1995-01-01), Fitch
patent: 5704416 (1998-01-01), Larson et al.
patent: 5848637 (1998-12-01), Lee
patent: 6062302 (2000-05-01), Davis et al.
patent: 6181556 (2001-01-01), Allman
patent: 6237223 (2001-05-01), McCullough
patent: 6394175 (2002-05-01), Chen et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6490160 (2002-12-01), Dibene, II et al.
patent: 6550531 (2003-04-01), Searls et al.
patent: 6650544 (2003-11-01), Lai
patent: 6745824 (2004-06-01), Lee et al.
patent: 6863119 (2005-03-01), Sugito et al.
patent: 6882051 (2005-04-01), Majumdar et al.
patent: 6910794 (2005-06-01), Rice
patent: 6978829 (2005-12-01), Lin
patent: 7269014 (2007-09-01), Zhao et al.
patent: 7278470 (2007-10-01), Xia et al.
patent: 7327576 (2008-02-01), Lee et al.
patent: 7370693 (2008-05-01), Lin
patent: 7382047 (2008-06-01), Chen et al.
patent: 2002/0021556 (2002-02-01), Dibene et al.
patent: 2002/0056908 (2002-05-01), Brownell et al.
patent: 2002/0118511 (2002-08-01), Dujari et al.
patent: 2003/0164289 (2003-09-01), Weihs et al.
patent: 2004/0165350 (2004-08-01), Fan
patent: 2004/0174651 (2004-09-01), Aisenbrey
patent: 2005/0028965 (2005-02-01), Chen
patent: 2005/0051607 (2005-03-01), Wang et al.
patent: 2005/0103476 (2005-05-01), Chen et al.
patent: 2005/0126766 (2005-06-01), Lee et al.
patent: 2005/0173098 (2005-08-01), Connors
patent: 2006/0037738 (2006-02-01), Li et al.
patent: 2006/0144574 (2006-07-01), Rosenfeld et al.
patent: 2006/0196640 (2006-09-01), Siu
patent: 2008/0043437 (2008-02-01), Refai-Ahmed
patent: 202005017349 (2006-01-01), None
patent: 2006033875 (2006-03-01), None
D. Van Heerden, T.R. Rude, J. Newson, J. He, E. Besnoin, O.M. Knio, and T.P. Weihs; “A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting”; IMAPS Symposium; 2003.
Levin, J., “Room Temperature Soldering of Connectors to PCB Using Reactive Multilayer Foils,” [2005], N. P.
“MCHX Technology,” N. D., N. P.
“Advancing Industrial Joining with Nanotechnology,” Reactive NanoTechnologies, N. D., Hunt Valley, ND.
“Innovative Fluidics Thermal Management Solutions,” downloaded from www.innovativefluidics.com on Aug. 17, 2006.
“Breakthrough Superlattice Technology,” downloaded from www.nextremetheremal.com on Aug. 17, 2006.
“Refined Cooling for Video Cards, pts. 1 and 2” downloaded from www.digit-life.com on Aug. 17, 2006.
International Search Report; European Patent Office; for International Application No. PCT/IB2007/002351; dated Jan. 16, 2008.
ATI Technologies ULC
Pape Zachary M
Vedder Price P.C.
LandOfFree
Cross-flow thermal management device and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cross-flow thermal management device and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cross-flow thermal management device and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2672867