Cross-flow redundant air cooling method for high reliability...

Details Cross-flow redundant air cooling method for high reliability... Cross-flow redundant air cooling method for high reliability...

2007-12-11

2007-12-11

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C165S080200, C165S104330, C454S184000

Reexamination Certificate

active

11249263

ABSTRACT:
An electronic assembly cooling system including a module case assembly that has a module case wall. The system includes a first and second air driver and an electronic assembly located in-front of the module case wall. The system conducts thermal energy from the electronic assembly from in-front of the module case wall to in-back of the module case wall, and directs air driven by the first air driver past the module case wall in-front of the module case wall to cool the electronic assembly via convective heat transfer. The system directs air driven by the second air driver past the module case wall in-back of the wall to transfer the thermal energy conducted from the electronic assembly from in-front of the module case wall to in-back of the module case wall to the air driven by the second air driver via conductive heat transfer to cool the electronic assembly.

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