Cross-fill pattern for metal fill levels, power supply...

Details Cross-fill pattern for metal fill levels, power supply... Cross-fill pattern for metal fill levels, power supply...

2006-01-26

2008-03-11

Lee, Calvin (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C438S618000

Reexamination Certificate

active

07342316

ABSTRACT:
A cross-fill metal fill pattern technique is provided such that portions of a metal fill pattern are patterned to accomplish a secondary function. For instance, in the exemplary embodiments, ever other trace or line of interdigitated fingers is routed to a ground, while the interceding traces or lines of interdigitated fingers are routed to a power supply. In this way, a capacitor function is formed across the power supply, providing additional decoupling for the power supply. Moreover, a suitably tight cross-fill metal fill pattern (i.e., higher density of metal) provides an electrical shielding function for electromagnetic radiation passing therethrough.

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StanleyWolf Silicon Processing for the VSLI Era vol. 2 Lattice Press 1990, p. 555.

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