Critical dimension measurement by diffration

Details Critical dimension measurement by diffration Critical dimension measurement by diffration

2006-05-02

2006-05-02

Gabor, Otilia (Department: 2884)

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

C250S252100

Reexamination Certificate

active

07038207

ABSTRACT:
Diffraction which is used to measure features on a substrate layer is disclosed. A substrate, such as a mask structure for microelectronics or a semiconductor substrate with reflective or transmissive features, is irradiated by a source emitting radiation of known wavelength at an angle of incidence relative to the substrate. Given a known pitch, the width of the features themselves is measured by analyzing a diffraction pattern by computer after capturing characteristics of the pattern with a detector.

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