Chemistry: electrical and wave energy – Processes and products
Patent
1989-04-03
1990-06-12
Valentine, Donald R.
Chemistry: electrical and wave energy
Processes and products
204 24, 204222, 204224R, 204273, 204225, 204288, 204279, 204278, 204297R, 204297W, 118428, 118429, 118500, 427 98, 4274431, C25D 502, C25D 508, C25D 1706, B05C 304
Patent
active
049330497
ABSTRACT:
In a system for electroplating a printed circuit board in which multiple spray orifices are provided in arrays on opposite sides of the circuit board, and multiple vacuum orifices are interspersed symmetrically and midway between adjacent spray orifices, a mounting means is provided for rapid and accurate locating of the printed circuit board in two selectively offset alternative positions to facilitate forming an electroplated layer of uniform thickness. The printed circuit board is supported from an elongate copper bar, with two alignment members mounted to opposite ends of the bar. A pair of saddles are fixed with respect to the tank containing the electrolyte. Each of the saddles has two V-shaped mounting surfaces conforming to the alignment members for a nesting engagement. The mounting surfaces of each saddle are offset from one another a predetermined horizontal and vertical distance, whereby alternative nesting engagements of the alignment members and saddles support the circuit borad in alternative positions, respectively aligning particular circuit board surface areas with spray orifices, and then with vacuum orifices.
REFERENCES:
patent: 3091217 (1963-05-01), Seymour
patent: 3158500 (1964-11-01), Sallo et al.
patent: 3522165 (1970-07-01), Jones et al.
patent: 3809642 (1974-05-01), Bond et al.
patent: 3895137 (1975-07-01), Avramidis et al.
patent: 4143618 (1979-03-01), Del Vecchio
patent: 4174261 (1979-11-01), Pellegrino
patent: 4262044 (1981-04-01), Kuczma, Jr.
patent: 4478882 (1984-10-01), Roberto
patent: 4500394 (1985-02-01), Rizzo
patent: 4606787 (1986-08-01), Pelligrino
patent: 4622917 (1986-11-01), Schramm
patent: 4628726 (1986-12-01), Heikkila et al.
patent: 4667049 (1987-05-01), Heikkila et al.
patent: 4734296 (1988-03-01), Schramm
patent: 4752371 (1988-06-01), Kriesel et al.
patent: 4789450 (1988-12-01), Paterson
Fisher James M.
Murphy Timothy I.
Bowen Gleen W.
Bramson Robert S.
Niebuhr Frederick W.
Unisys Corporation
Valentine Donald R.
LandOfFree
Cradle for supporting printed circuit board between plating mani does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cradle for supporting printed circuit board between plating mani, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cradle for supporting printed circuit board between plating mani will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-615436