Crack stops for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Reexamination Certificate

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C257SE21238, C438S462000

Reexamination Certificate

active

08008750

ABSTRACT:
Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plurality of substantially V-shaped regions is disposed adjacent another of the plurality of substantially V-shaped regions.

REFERENCES:
patent: 5834829 (1998-11-01), Dinkel et al.
patent: 6022791 (2000-02-01), Cook et al.
patent: 6163065 (2000-12-01), Seshan et al.
patent: 6271578 (2001-08-01), Mitwalsky et al.
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6495918 (2002-12-01), Brintzinger
patent: 6841455 (2005-01-01), West et al.
patent: 7235864 (2007-06-01), Lee
patent: 2005/0151239 (2005-07-01), Lee
patent: 2005/0191845 (2005-09-01), Takada
patent: 2006/0220250 (2006-10-01), Kim et al.
patent: 2009/0166810 (2009-07-01), Stillman et al.

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