Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-11-14
2001-10-30
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S690000, C361S694000, C361S704000, C361S709000, C361S710000, C257S718000, C257S719000, C257S722000, C174S016100, C174S016300, C165S080300, C165S185000
Reexamination Certificate
active
06310771
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention to apparatus adapted to dissipate heat from a CPU and, more particularly, to a high performance CPU heat sink for quick dissipation of heat from a CPU.
Following fast development of high-tech, the operation speed of the CPU (central processing unit)—the heart of a computer—is made faster than ever. However, a high performance CPU produces much heat during its operation, and heat must be quickly carried away so as not to affect the function of the CPU. Various cooling devices and structures have been disclosed for this purpose.
FIG. 9
shows a CPU cooling structure according to the prior art. This CPU cooling structure comprises a heat sink
5
having upright radiating fins
51
, a clamp
6
adapted to secure the heat sink
5
to a CPU. and a fan
7
adapted to blow air through the heat sink
51
for quick dissipation of heat. This CPU cooling structure is still not satisfactory in function, and has numerous drawbacks as outlined hereinafter.
1. Because the heat sink
5
is made of aluminum by die cast, the thickness of the radiating fins
51
of the heat sink
5
cannot be reduced to the satisfactory status (thinner than 1 mm). The heat dissipation efficiency of thick radiating fins is low.
2. Because the heat sink
5
is made subject to a particular model of fan, a different size of heat sink should be used to match with a different size of fan.
3. Because the base of the heat sink is a flat surface, the downwardly protruded middle pressure portion
61
of the clamp
6
may slip on the base of the heat sink after installation of the clamp
6
.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the circumstances in view. According to one aspect of the present invention, the CPU heat sink comprises a copper bottom panel, a plurality of copper radiating fins arranged in parallel on the bottom panel, the radiating fins each having a transverse foot bar, a plurality of strips respectively upwardly extended from the transverse foot bar and arranged in parallel, and a plurality of horizontal locating flanges respectively extended from the transverse foot bar at right angles, and an aluminum base molded on the bottom panel and the transverse foot bar and locating flanges of each radiating fin by die casting, the aluminum base having four upright posts disposed in four corners, the upright posts each having a square top and a screw hole on the square top, and four bearing blocks respectively fastened to the upright posts of the aluminum base and adapted to support a fan above the radiating fins, the bearing blocks each having a countersunk hole fastened to the screw hole of one upright post of the aluminum base by a screw, and at least one screw hole for the mounting of a fan. According to another aspect of the present invention, the strips of the radiating fins are stepped strips, each having a width made gradually reduced from the transverse foot bar toward the distal end for quick dissipation of heat. According to another aspect of the present invention, different sizes of bearing blocks can be selectively fastened to the upright posts of the aluminum base of the heat sink to support any of a variety of fans. According to still another aspect of the present invention, the aluminum base of the heat sink has a top center recess for positive positioning of the downwardly protruded middle pressure portion of a clamp being used to secure the heat sink to a CPU.
REFERENCES:
patent: 5558155 (1996-09-01), Ito
patent: 5864464 (1999-01-01), Lin
patent: 6017185 (2000-01-01), Kuo
patent: 6062301 (2000-05-01), Lu
patent: 6104609 (2000-08-01), Chen
Chervinsky Boris L.
Rosenberg , Klein & Lee
Tolin Gerald
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