Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-01-08
2000-08-22
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257722, 361690, H05H 722
Patent
active
06108204&
ABSTRACT:
A cooling system for a multi processor system mounted in a rack that has a top, a bottom, sides and a plurality of card cages. Each of the card cages has card guides for receiving mother boards such that the mother boards are positioned vertically within the rack. A CPU is mounted on a mother board and a heat sink is mounted on top of the CPU and fastened to the mother board. The heat sink includes a plurality of air passages and is positioned with respect to the mother board such that when the mother board is mounted in the rack, the air passages are vertical. A blower is integrated into the rack such that air flows vertically through the rack. Also a heat sink for use on a baby AT mother board on which a CPU socket is mounted and into which a CPU is plugged. The baby AT mother board further includes a plurality of sockets for expansion boards to be mounted such that the expansion boards when plugged into the expansion board sockets are substantially perpendicular to the baby AT mother board a specified height above the baby AT mother board. Some number of expansion boards extend above the top surface of the CPU. The heat sink is a heat conductive body having fins and is mounted on the top surface of the CPU and extends beyond the top surface area of the CPU. But, the heat sink in combination with the CPU socket and the "PENTIUM" CPU are less in height than the specified height that the expansion board is above the baby AT mother board.
REFERENCES:
patent: 4360141 (1982-11-01), Kensrue
patent: 5285347 (1994-02-01), Fox et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5398161 (1995-03-01), Roy
patent: 5424913 (1995-06-01), Swindler
patent: 5430609 (1995-07-01), Kikinis
Brotherton Daniel
Haider Syed
Shipley Fred J.
Intel Corporation
Thompson Gregory
LandOfFree
CPU heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with CPU heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CPU heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-588261