Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-10-13
2001-12-25
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S121000, C165S185000, C361S704000, C361S715000, C454S184000
Reexamination Certificate
active
06333852
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a CPU (central processing unit) heat dissipation device with special fins, especially to a CPU heat dissipation device with elliptic fins, strip-shaped fins, and foliar fins and crescent fins that forms a plurality of high-pressure channels in order to increase velocity of the air current.
The conventional location of the CPU in computers is far from air outlets thus even with fans, the efficiency of heat dissipation is not sufficient due to the long pathway of hot airflow. And the temperature of CPU under operation can't be kept inside the safe range. Refer to
FIG. 3
, the conventional heat dissipation device for CPU includes a CPU (a) and a fan sink (b) mounted thereabove. The fan sink (b) includes a slot (b
1
) thereon and a plurality of longitudinal fins (b
2
) fixed inside the slot (b
1
). A socket (b
3
) for accommodating a fan (c) is arranged on one side of the slot (b
1
). Therefore, the heat generating from CPU (a) is absorbed by the fan sink (b) and is dissipated by fan (c).
However, due to the longitudinal shape of fins (b
2
) on the heat sink (b), airflow drawn by the fan (c) flows through the slot (b
1
) in the same velocity so that the heat can't be brought out effectively and the efficiency of heat dispersion is not well.
Furthermore, three lateral walls of the socket (b
3
) in the fan sink (b) for accommodating a fan (c) is closed without any outlets. Thus when the fan (c) is running for inducing fresh air, the vortex of air current is produced that stays in the socket (b
3
) so that the wind pressure and resistance are increased. Therefore, the current can't flow fluently and the efficiency of heat dissipation is decreased.
SUMMARY OF THE INVENTION
It is therefore a primary object of the present invention to provide a CPU heat dissipation device with different kind of fins such as elliptic fins, strip-shaped, foliar fins, crescent fins. These various fins form high pressure channels for increasing the velocity air current and for enhancing the efficiency of heat dissipation.
In order to achieve the object mentioned above, the CPU heat dissipation device with special fins includes a fan sink mounted above a CPU with a plurality of fins, a fan and a cover thereof. A slot is mounted on the fan sink while a socket for mounting a fan is disposed on one side thereof. The cover is covered on the top of the fan sink. The characteristic of the device is in special fins which have different designs such as elliptic shaped, strip-shaped, foliar shape, and crescent shape. In accordance with the structure mentioned above, the velocity of airflow is increased by the high-pressure channels composed of various kinds of fins. Thus the heat dispersion rate can be improved.
REFERENCES:
patent: 5727624 (1998-03-01), Ko et al.
patent: 5884691 (1999-03-01), Batchelder
patent: 5940269 (1999-08-01), Ko et al.
patent: 6170563 (2001-01-01), Hsieh
Jacobson & Holman PLLC
Thompson Gregory
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