CPU heat dissipating device

Details CPU heat dissipating device CPU heat dissipating device

1996-08-12

1998-06-16

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361809, H05K 720

Patent

active

057681023

ABSTRACT:
A CPU heat dissipating device including a CPU mount having a center opening and a plurality of raised portions spaced around the center opening at the top, a CPU mounted on the CPU mount and spaced from the top side of the CPU mount by the raised portions thereof, a heat sink attached to the CPU at the top, and a fan controlled to draw outside air into the center opening of the CPU mount, permitting it to be forced horizontally outwards through the gap between the CPU mount and the CPU in all directions.

REFERENCES:
IBM Tech. Disclosure Bulletin, "Cooling of Single Chip Module or Multi Chip Module with Surface Mount Array Process", vol. 36, No. 07, Jul. 1993, pp. 101-102, 361/695.

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