Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-01
1998-11-10
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165122, 165165, 257722, 257719, 415178, 361719, 361704, H05K 720
Patent
active
058353470
ABSTRACT:
A CPU heat dissipating device includes a base made of heat conductive material, having a plurality of spaced fins defining air passages therebetween. A fan is disposed on the fins to induce force convection. An enlarged channel is formed between the fins to received therein an I-shaped spring plate having four co-planar limbs, each having an arm extending therefrom and substantially normal thereto with a catch formed on the free end of the arm to be received within a corresponding hole formed on a CPU casing. A circular bore is formed on the bottom of the channel and in communication therewith by means of a neck which supports the spring plate thereon. A circular rod is rotatably received within the bore, on which two radially-extending projections are provided. A transverse extension is provided on the rod for manually rotating the rod about its central axis so as to rotate the radial projections between a disengaged position where the projections are not in contact engagement with the spring plate and an engaged position where the projections are brought into contact engagement with and thus causing elastic deformation of the spring plate so as to drive the catches of the arms of the spring plate to engage the holes of the CPU casing and thus securing the heat dissipating device to the CPU.
REFERENCES:
patent: 5329426 (1994-07-01), Villani
patent: 5368094 (1994-11-01), Hung
patent: 5430610 (1995-07-01), Hung
patent: 5724228 (1996-08-01), Lee
Asia Vital Components Co. Ltd.
Datskovsky Michael
Picard Leo P.
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