CPU heat dissipating apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

165 803, 165121, 165185, 257718, H05K 720

Patent

active

054953928

ABSTRACT:
A CPU heat dissipating apparatus including a radiating panel attached to the top side of a CPU to hold a fan between two opposite upright side walls on the radiating panel, and a mounting frame fastened to the CPU to hold down the heat sink, wherein the mounting frame has two short downward hooks respectively hooked on two opposite mounting grooves on two opposite upright side walls of the radiating panel, two long downward hooks hooked on the border of the CPU to tightly secure the radiating panel to the CPU, and two oblique finger plates for moving by fingers to deform the mounting frame for permitting the long downward hooks to be hooked on or released from the CPU.

REFERENCES:
patent: 5287249 (1994-02-01), Chen
patent: 5299632 (1994-04-01), Lee
patent: 5421402 (1995-06-01), Lin
patent: 5430610 (1995-07-01), Hung

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