CPU heat dissipating apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

165 803, 165185, 174 163, 257719, 361704, H05K 720

Patent

active

057711534

ABSTRACT:
A CPU heat dissipating apparatus includes a heat sink attached to a CPU shell for dissipating of heat from it, an elongated clamping plate mounted in a longitudinal passage between two arrays of radiating fins on the heat sink and hooked on the CPU shell to secure the heat sink and the CPU shell together, and a lock bolt inserted into an oblong mounting hole on the elongated clamping plate and a corresponding oblong mounting hole on the heat sink and a corresponding oblong mounting hole on the CPU shell and then turned through 90 degrees to lock the elongated clamping plate and the heat sink and the CPU shell together.

REFERENCES:
patent: 5309983 (1994-05-01), Bailey
patent: 5570271 (1996-10-01), Lauochkin
patent: 5594623 (1997-01-01), Schwegler
patent: 5602719 (1997-02-01), Kinion
patent: 5684676 (1997-11-01), Lin

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