Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-02-21
2004-09-28
Thompson, Gregory D. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C062S003200, C062S003700, C062S259200, C361S704000, C361S710000, C165S080300, C165S185000, C165S121000
Reexamination Certificate
active
06798659
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooling structure for cooling a CPU or the like and, more particularly, to such a CPU cooling structure, which uses a thermoelectric cooling panel to enhance the cooling effect.
2. Description of the Related Art
FIG. 1
illustrates a CPU cooling structure constructed according to the prior art. According to this design, the CPU cooling structure comprises a heat sink
20
′, the heat sink
20
′ having a flat bottom contact wall
23
′ adapted to absorb heat from the CPU to be cooled, a fan
10
′ mounted on the top side of the heat sink
20
′ and adapted to induce currents of air through gaps in the heat sink
20
′, and a power cable
30
′ electrically connected to the fan
10
′ and adapted to obtain power supply from the host computer containing the CPU. The cooling efficiency of this design of CPU cooling structure is low. When the CPU continuously running for a long time, the heat sink
20
′ and the fan
10
′ cannot effectively lower the temperature of the CPU. When the ambient temperature is excessively high, the CPU will break down.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a CPU cooling structure, which achieves a high cooling performance. It is another object of the present invention to provide a CPU cooling structure, which uses a thermoelectric cooling panel to enhance the cooling effect. IT is still another object of the present invention to provide a CPU cooling structure, which can be used in a computer, machinery, or any of a variety of electric and electronic apparatus that use a CPU for operation control. According to the present invention, the CPU cooling structure comprises a heat sink, a fan mounted on the top side of the heat sink, a thermoelectric cooling panel mounted in the bottom side of the heat sink in a flash manner, a metal contact plate bonded to the bottom side of the heat sink to seal the thermoelectric cooling panel and adapted to contact the CPU to be cooled, and a control circuit adapted to control the operation of the fan and the thermoelectric cooling panel.
REFERENCES:
patent: 5419780 (1995-05-01), Suski
patent: 5456081 (1995-10-01), Chrysler et al.
patent: 5457342 (1995-10-01), Herbst, II
patent: 5655375 (1997-08-01), Ju
patent: 5676199 (1997-10-01), Lee
patent: 6094919 (2000-08-01), Bhatia
patent: 6324058 (2001-11-01), Hsiao
patent: 6424533 (2002-07-01), Chu et al.
LandOfFree
CPU cooling structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with CPU cooling structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CPU cooling structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3200347