Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2001-11-13
2002-07-16
Leo, Leonard (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S121000, C165S185000, C174S016300, C257S719000, C361S697000, C361S704000
Reexamination Certificate
active
06419008
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the field of a cooling device for central processing units (CPUs), and more particularly, to a CPU cooling device mounting mechanism having dual mounting purposes.
2. Description of the Prior Art
FIG. 1
shows an exploded view of prior art cooling device assembly. The prior art cooling device assembly generally includes a base frame
1
a
, a radiator
2
a
, a top frame
3
a
, a fan
4
a
, a pair of spring strips
5
a
, a pair of pressing strips
6
a
, a pair of screws
7
a
and a pair of screw nuts
8
a
. The base frame
1
a
includes a frame body
11
a
having an inner periphery
12
a
on which a plurality of positioning holes are disposed. The base frame
1
a
is fixed on a printed circuit board (not shown) by means of the positioning holes
13
a
and mounting pieces. The inner periphery
12
a
defines a main opening for accommodating a central processing unit (CPU) that is attached to a bottom surface of the radiator
2
a
when installation. Typically, the radiator
2
a
has a plurality radiating fins and is monolithically made of metallic materials known in the art.
As shown in
FIG. 1
, the frame body
11
a
has four protruding plate
14
a
extending upwardly in corners of the frame body
11
a
. Each protruding plate
14
a
has a through hole
15
a
. The radiator
1
a
is fittingly installed in the base frame
1
a
and supported by the inner periphery
12
a
. Since the radiator
2
a
is higher than the base frame
1
a
, the top frame
3
a
is therefore needed. The top frame
3
a
has a frame body
31
a
with four snapping feet
32
a
extending downwardly in the corners of the frame body
31
a
. Each of the snapping feet
32
a
has a distal snapping end that engages with the associated protruding plate
14
a
of the frame body
11
a
. In this way, the radiator
2
a
is restrained by the engaged base frame a and top frame
3
a
. The top frame
3
a
further includes a corner stage
34
a
for locking the fan
4
a
by screws. Two pairs of upwardly extended snapping feet
31
a
are provided on two opposite sides of the frame body
31
a
for clamping the fan
4
a.
The frame body
31
a
further includes a central grooves
36
a
and two side grooves
37
a
on one side of the frame body
31
a
. A center part of the spring strip
5
a
with a ladder shape is mounted into the central groove
36
a
. The pressing strip
6
a
is archwise-shaped and has a protruding block
61
a
, which is embedded in the side groove
37
a
, disposed in opposite ends of the spring strip
5
a
. The screw
7
a
is inserted into a center hole
62
a
of the pressing strip
6
a
and fastened with the screw nut
8
a.
By this configuration, the snapping feet
32
a
can be controlled by the screw
7
a
. However, the radiator
2
a
cannot be steadily restrained by using the prior art structure, since the top frame
3
a
and base frame
1
a
just encompass the radiator
2
a
. Furthermore, the prior art cooling device assembly is complicated and not user-friendly either during assembling or disassembling.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide a mounting mechanism for a CPU cooling device.
It is another object of the present invention to provide pairs of wedge members for easily mounting a radiator on a fixing frame so as to form a steady cooling mechanism.
It is still another object of the present invention to provide a cooling device mounting mechanism with pairs of wedge members for easily and simultaneously mounting a radiator and a fan on a fixing frame so as to form a steady cooling structure by only the latching of the pairs of the wedge members.
It is still another object of the present invention to provide a mechanism CPU cooling devices with characteristics of fast assembling and fast disassembling.
It is still another object of the present invention to provide a wedge member having a snapping plate formed integral with the wedge member.
It is still another object of the present invention to provide a wedge member having a protruding block facilitating installation of mounting pieces into a printed circuit board.
According to the claimed invention, the mounting mechanism for CPU cooling devices comprises a fixing frame, a radiator, a fan casing, and at least one pair of wedge members. The fixing frame includes a frame base, an inner periphery located on an inner side of the frame base, at least two mounting holes positioned on the inner periphery for mounting the fixing frame on a circuit board by inserting mounting pieces into the mounting holes, a main opening located at center part of the fixing frame for accommodating a CPU. The fixing frame has four side faces, wherein two opposite side faces thereof each has two ends each extended to a vertical plate with a through hole, while the other side faces is arranged with flanges, respectively.
The radiator has a bottom surface in contact with the CPU, a ledge at periphery of the radiator for connecting with the inner periphery of the fixing frame, and at least one groove located on the ledge.
The wedge member has a positioning end for passing through the through hole of the vertical plate, a protruding block, a snapping plate for retaining the fixing frame by means of engagement of a distal snapping end on the snapping plate and the flange of the fixing frame, and an embedding plate for locking the radiator by inserting the embedding plate into the groove on the ledge.
It is to be understood that both the forgoing general description and the following detailed description are exemplary, and are intended to provide at further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
REFERENCES:
patent: 5930116 (1999-07-01), Palmer
patent: 6082440 (2000-07-01), Clemens et al.
patent: 6201697 (2001-03-01), McCullough
patent: 6205026 (2001-03-01), Wong et al.
patent: 6243265 (2001-06-01), Wong et al.
Leo Leonard
Nextronics Engineering Corp.
Rosenberg , Klein & Lee
LandOfFree
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