CPU cooling arrangement

Details CPU cooling arrangement CPU cooling arrangement

1998-01-27

1999-06-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361697, 257722, 174 161, 174 163, 165 803, H05K 720

Patent

active

059176970

ABSTRACT:
CPU cooling arrangement including a hood covered on a fan above a heat sink at the top of a CPU inside a computer mainframe, the hood having at least one air inlet, and at least one air pipe for guiding outside cooling air to the heat sink, each air pipe having one end connected to one air inlet on the hood and an opposite end connected to the outside of the computer mainframe.

REFERENCES:
patent: 5107398 (1992-04-01), Bailey
patent: 5497825 (1996-03-01), Yu
patent: 5566377 (1996-10-01), Lee
patent: 5583316 (1996-12-01), Kitahara et al.
patent: 5630469 (1997-05-01), Butterbaugh et al.

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