Coverlay for printed circuit boards

Details Coverlay for printed circuit boards Coverlay for printed circuit boards

1996-04-22

1997-10-07

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

361748, 361749, 174258, 174259, 428901, B32B 900

Patent

active

056745958

ABSTRACT:
A flexible circuit board having an improved protective coverlay is provided. The product flexible circuit board comprises a flexible, dielectric substrate, one or more electrical conductors carried on the surface thereof, one or more electrical contact bumps in electrical communication with the conductors, and an improved protective coverlay electrically insulating the electrical conductors. The coverlay, which is a solid, tack-free film bonded to the surface of the dielectric substrate, is formed in situ from one or more layers of flexible, dielectric, polymeric adhesives and avoids the use of a pre-formed, self-supporting film.

REFERENCES:
patent: 4568592 (1986-02-01), Kawguchi
patent: 4762747 (1988-08-01), Liu et al.
patent: 5084124 (1992-01-01), Taniguchi
patent: 5344893 (1994-09-01), Asai
patent: 5502889 (1996-04-01), Casson
patent: 5514449 (1996-05-01), Tingerthal
Webster's II, New Riverside Dictionary pp. 78, 1177.

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