Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-07-05
2003-09-02
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S800000, C361S803000, C361S818000, C361S816000, C361S748000, C361S796000
Reexamination Certificate
active
06614661
ABSTRACT:
BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION
The present invention relates to a covering device for ceramic modules having electronic components which are arranged between a ceramic substrate and an upper covering plate of the covering device.
A covering device of this type is needed for high-frequency ceramic modules, in order to shield the components on the surface of the ceramic substrate, fitted with components, and to protect them against mechanical damage. When the covering devices are put onto the ceramic substrates, subsequent mechanical deformations of the covering device are necessary in order to fix the covering devices to the ceramic module with a form fit. In the process, the ceramic substrates can be damaged. In particular in the case of highly complex multilayer HF ceramic modules, damage of this type entails high losses.
SUMMARY OF THE INVENTION
The object of the present invention is to provide a shielding device which overcomes the above-noted deficiencies and disadvantages of the prior art devices and methods of this general kind, and which can be fixed to the ceramic module without subsequent mechanical deformation.
With the above and other objects in view there is provided, in accordance with the invention, a covering device for a ceramic module of the type having electronic components arranged on a surface of a ceramic substrate, the covering device comprising:
an upper covering plate to be disposed above the electronic components on the surface of the ceramic substrate;
spacers supporting the covering device on the surface of the ceramic substrate fitted with the electronic components;
snap-in elements on at least two opposite side edge areas of the covering device, said snap-in elements engaging with at least one of a frictional fit and a form fit in lateral cutouts formed in the ceramic substrate and corresponding to said snap-in elements.
In other words, the covering device is supported on the surface of the ceramic substrate, fitted with components, via spacers, and the covering device has, on at least two opposite side edge areas, snap-in elements which engage with a frictional and form fit in lateral cutouts in the ceramic substrate corresponding to the snap-in elements.
The subject of the invention has the advantage that, with the snap-in elements, the different dimensions of the ceramic substrates, which are subject to high production fluctuations, can be compensated for, since the covering device adapts to the outlines of the ceramic substrate within wide limits during assembly. It is therefore not necessary for specific tolerance classes for the covering device to be kept in store, instead one covering device can be used for a wide range of tolerance classes of ceramic modules.
When the covering device is put onto a ceramic module, the snap-in elements are deliberately overstretched and then snap back again into the initial position as a result of their spring action, engaging in the cutouts in the ceramic substrate. At the same time, by means of a frictional fit in the plane parallel to the component fitting surface, the covering device is fixed and, by a form fit in the direction perpendicular thereto, the Z direction, the covering device is prevented from becoming detached from the ceramic substrate as it is put onto a printed circuit board or during subsequent further processing to form an end product. Because of the snap-in elements, mechanical reworking of the covering device is no longer required, so that the reject rate is reduced considerably, since damage both to the ceramic substrate and to the covering device is avoided. Furthermore, the handling and process sequence are significantly simplified.
In accordance with an added feature of the invention, the covering device is provided for box-shaped ceramic modules in HF technology and is itself of box-like design, the spacers used being angle pieces supported in the corner regions of the surface of the ceramic substrate fitted with components, while side edge areas of the box-like covering device are spaced apart from the surface fitted with components.
For the purpose of engaging with a form fit in the cutout in the ceramic substrate, at least one snap-in element has a form-fitting element for the fixing in the Z direction, the Z direction extending vertically with respect to the surface of the ceramic substrate fitted with components. The form-fitting element of a snap-in element substantially comprises an angled portion or a projection of the snap-in element in the direction of lateral cutouts in the ceramic substrate.
In addition to the form-fitting element, a snap-in element has at least one frictional-fitting part, which fixes the covering device in the X-Y plane, which extends parallel to the surface of the ceramic substrate fitted with components. A frictional-fitting part of this type in one embodiment comprises a snap-in element arranged on opposite sides, the frictional-fitting part itself comprising two springs which press the snap-in element onto the ceramic substrate. When four snap-in elements are provided, engaging with four sides of the ceramic substrate, such a frictional fit in the X-Y plane is implemented with further increased security.
In one embodiment, a snap-in element has a lug which is preshaped in an L-shape and whose longitudinal limb extends laterally along the ceramic substrate and whose transverse limb engages in the lateral cutout in the ceramic substrate. Such a lug-like design of the snap-in elements has the advantage that the snap-in elements and the covering plate of the covering device can be formed from the same material, specifically advantageously a sheet-metal strip. A sheet-metal strip of this type can be produced from spring bronze, from sheet iron, which shields electromagnetic waves, or from aluminum sheet. The L-shaped lug can already be designed as a leaf spring on its longitudinal limb.
In a further embodiment of the invention, the snap-in element is arranged with its upper end on the upper covering plate of the covering device. This arrangement makes it possible for snap-in elements arranged in pairs to be spread apart from each other with the aid of a spreading tool and to snap back into their initial form as soon as the lateral cutout on the ceramic module has been reached, wherein cutout the snap-in elements engage.
In a further embodiment of the invention, the snap-in element is arranged with its upper end in the center of a torsion beam, which is molded into the upper covering plate. In this embodiment, the snap-in element may be stiff in its longitudinal extent, since the torsion beam molded into the upper covering plate performs the spring action. In order to shape a torsion beam out of the upper covering plate, a U-shaped cutout is formed in the covering plate, its side limbs defining the length of the torsion beam and its transverse limb defining a first longitudinal side of the torsion beam. The snap-in element is arranged with its upper region on a second longitudinal side of the torsion beam, located opposite the first longitudinal side. When the snap-in element is spread with the aid of a spreading tool, at the same time the torsion beam molded into the covering plate is rotated and springs back into its initial position as soon as the formfitting element of the snap-in element has reached the cutout in the ceramic substrate, and therefore the snap-in element engages in the cutout after the spreading tool has been removed.
In a further embodiment of the invention, the ceramic substrate has transverse grooves in its edge areas. By using the transverse grooves, the individual layers of a multilayer ceramic substrate can be connected to one another by means of external metallization of the transverse grooves. However, the transverse grooves can also be used to solder dowel pins or contact pins to the ceramic module.
In a further embodiment of the invention, the ceramic substrate has a plurality of ceramic layers, conductor track layers and layers with thin-layer components such as resistors and capacitors, it being possi
Gottswinter Christian
Neuhoff Oskar
Stadler Bernd
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Martin David
Stemer Werner H.
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