Covered wire connection method and structure

Details Covered wire connection method and structure Covered wire connection method and structure

1997-06-02

1999-07-20

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 731, 174 84R, B32B 3116

Patent

active

059252022

ABSTRACT:
Two covered wires are conductively connected to each other by overlapping with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. By melting cover portions and pressing resin chips from outside, the conductive wire portions of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips are melt-fixed to each other to seal the connection portions. A crossing angle .theta. of the two covered wires at the connection portion is set to no less than 45.degree. and greater than 135.degree.. Thus, the covered wires can be conductively connected with each other inexpensively and easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.

REFERENCES:
patent: 2250156 (1941-07-01), Ferguson
patent: 3418444 (1968-12-01), Ruehlemann
patent: 3573713 (1971-04-01), Enright et al.
patent: 3910448 (1975-10-01), Evans et al.
patent: 4878969 (1989-11-01), Janisch
patent: 5584122 (1996-12-01), Kato et al.

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