Covered devices in a semiconductor package

Details Covered devices in a semiconductor package Covered devices in a semiconductor package

2009-07-27

2010-11-02

Kebede, Brook (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S706000, C257SE23101

Reexamination Certificate

active

07825503

ABSTRACT:
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.

REFERENCES:
patent: 5276289 (1994-01-01), Satoh et al.
patent: 2004/0130012 (2004-07-01), Hedler
patent: 2006/0118925 (2006-06-01), Macris et al.

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