Covered devices in a semiconductor package

Details Covered devices in a semiconductor package Covered devices in a semiconductor package

2006-03-30

2009-11-24

Kebede, Brook (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C438S125000

Reexamination Certificate

active

07622327

ABSTRACT:
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.

REFERENCES:
patent: 6459144 (2002-10-01), Pu et al.
patent: 2003/0183909 (2003-10-01), Chiu
patent: 2004/0130012 (2004-07-01), Hedler
patent: 2005/0213301 (2005-09-01), Prasher
patent: 2006/0118925 (2006-06-01), Macris et al.

Affiliated with

Also associated with

Rating

Covered devices in a semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Covered devices in a semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Covered devices in a semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4071755