Cover tape for packaging semiconductor device and package...

Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components

Reexamination Certificate

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Details

C257S678000, C206S713000

Reexamination Certificate

active

08033397

ABSTRACT:
The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.

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Japanese Office Action dated Apr. 19, 2011, for Japanese Patent Application No. 2006-073586.

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