Cover tape for packaging chip type electronic parts

Details Cover tape for packaging chip type electronic parts Cover tape for packaging chip type electronic parts

1991-10-30

1993-05-04

Davis, Jenna L.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428323, 428328, 428329, 428349, 428355, 428922, B32B 516, B32B 712

Patent

active

052081036

ABSTRACT:
The present invention provides a cover tape used for packaging of electronic parts in the form of a chip, which comprises an outer layer, an intermediate layer and an adhesion layer and which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film, the intermediate layer is a polyolefin film which causes its own cohesive failure to enable peeling, and the adhesion layer consists of a dispersion of conductive fine powders of tin oxide or the like in a thermoplastic resin. In the cover tape, the adhesion layer has been subjected to antistatic treatment using the conductive fine powders, and hence generation of static electricity by the contact of the electronic parts with the cover tape or at the time of cover tape pelling is reduced, and the antistatic effect is stable against the use conditions and the lapse of time and has no influence on the sealing property of the cover tape.

REFERENCES:
patent: 4156751 (1979-05-01), Yenni, Jr. et al.
patent: 4343855 (1982-08-01), Conder
patent: 4367312 (1983-01-01), Bontinck et al.
patent: 4648508 (1987-03-01), Neal et al.
patent: 4699830 (1987-10-01), White
patent: 4929486 (1990-05-01), Itou et al.
patent: 4956232 (1990-09-01), Balloni et al.
patent: 4963405 (1990-10-01), Yamashita et al.
patent: 4999242 (1991-03-01), Ishiwata et al.
J86-12936 Abst.

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